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INTEGRATED CIRCUITS
DATA SHEET
UBA2014 600 V driver IC for HF fluorescent lamps
Product specification 2002 May 16
Philips Semiconductors
Product specification
600 V driver IC for HF fluorescent lamps
FEATURES * Adjustable preheat time * Adjustable preheat current * Current controlled operating * Single ignition attempt * Adaptive non-overlap time control * Integrated high-voltage level-shift function * Power-down function * Protection against lamp failures or lamp removal * Capacitive mode protection. APPLICATIONS The circuit topology enables a broad range of ballast applications at different mains voltages for driving lamp types from e.g. T8, T5, PLC, T10, T12, PLL and PLT. ORDERING INFORMATION TYPE NUMBER UBA2014T UBA2014P PACKAGE NAME SO16 DIP16 DESCRIPTION plastic small outline package; 16 leads; body width 3.9 mm plastic dual in-line package; 16 leads (300 mil); long body GENERAL DESCRIPTION
UBA2014
The IC is a monolithic integrated circuit for driving electronically ballasted fluorescent lamps, with mains voltages up to 277 V (RMS) (nominal value). The circuit is made in a 650 V BCD power-logic process. It provides the drive function for the 2 discrete power MOSFETs. Beside the drive function the IC also includes the level-shift circuit, the oscillator function, a lamp voltage monitor, a current control function, a timer function and protections.
VERSION SOT109-1 SOT38-1
2002 May 16
2
Philips Semiconductors
Product specification
600 V driver IC for HF fluorescent lamps
UBA2014
QUICK REFERENCE DATA All voltages are referenced to GND; VDD = 13 V; VFVDD - VSH = 13 V; Tamb = 25 C; unless otherwise specified; see Chapter "Application information". SYMBOL High-voltage supply VHS Start-up state VDD(start) VDD(stop) IDD(start) VVref fmax fmin Output drivers Isource(GH) Isink(GH) Vph Vlamp(fail) Vlamp(max) output driver source current output driver sink current VGH - VSH = 0; VGL = 0 VGH - VSH = 13 V - - - 0.77 1.44 180 300 - - - 0.85 1.54 mA mA oscillator start voltage oscillator stop voltage start-up current VDD < VDD(start) IL = 10 A 12.4 - - - - 38.9 13.0 9.1 170 13.6 - 200 - - 42.1 V V A V high side supply voltage IHS < 30 A; t < 1 s - - 600 V PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Reference voltage reference voltage 2.95
Voltage controlled oscillator maximum bridge frequency minimum bridge frequency 100 40.5 kHz kHz
Preheat current sensor preheat voltage level 0.60 V
Lamp voltage sensor lamp fail voltage level at pin LVS maximum lamp voltage level at pin LVS 0.81 1.49 V V
Average current sensor Voffset gm Timer tph VOL(CT) VOH(CT) preheat time LOW-level output voltage at pin CT HIGH-level output voltage at pin CT CCT = 330 nF; RIREF = 33 k 1.6 - - 1.8 1.4 3.6 2.0 - - s V V offset voltage transconductance VCS = 0 to 2.5 V f = 1 kHz -2 - 0 3800 +2 - mV A/mV
2002 May 16
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ndbook, full pagewidth
COUNTER
LOGIC
2002 May 16
SUPPLY GND 5 PREHEAT TIMER
BLOCK DIAGRAM
Philips Semiconductors
600 V driver IC for HF fluorescent lamps
VDD 7
Vref
14 3V
9 Vpd reference voltages supply (5 V) BOOTSTRAP LEVEL SHIFTER HS DRIVER 10 11 LS DRIVER 6
FVDD
GH SH GL
digital analog
UBA2014
VDD(L) DRIVER LOGIC reset STATE LOGIC ANT/CMD
12
ACM
LOGIC
* reset state * start-up state * preheat state * ignition state * burn state * hold state * power-down state
4
CT 1 VOLTAGE CONTROLLED OSCILLATOR REFERENCE CURRENT I V 4 IREF 3 CF
PCS
8
PCS
LOGIC LAMP VOLTAGE SENSOR AVERAGE CURRENT SENSOR Vlamp(fail) Vlamp(max) FREQUENCY CONTROL 15 16 CS+ CS-
Product specification
UBA2014
13 LVS
2
MGW579
CSW
Fig.1 Block diagram.
Philips Semiconductors
Product specification
600 V driver IC for HF fluorescent lamps
PINNING SYMBOL CT CSW CF IREF GND GL VDD PCS FVDD GH SH ACM LVS Vref CS+ CS- PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 preheat timer output voltage controlled oscillator input oscillator output internal reference current input ground gate output for the low-side switch low-voltage supply preheat current sensor input DESCRIPTION
UBA2014
floating supply, supply for the high-side switch gate output for the high-side switch source of the high-side switch capacitive mode input lamp voltage sensor input reference voltage output positive input for the average current sensor negative input for the average current sensor
handbook, halfpage
CT 1 CSW 2 CF 3 IREF 4
16 CS - 15 CS + 14 Vref 13 LVS
handbook, halfpage
CT 1 CSW 2 CF 3 IREF 4
16 CS - 15 CS + 14 Vref 13 LVS
UBA2014P
GND 5 GL 6 VDD 7 PCS 8
MGW580
UBA2014T
12 ACM 11 SH 10 GH 9 FVDD
GND 5 GL 6 VDD 7 PCS 8
MGW581
12 ACM 11 SH 10 GH 9 FVDD
Fig.2 Pin configuration (DIP16).
Fig.3 Pin configuration (SO16).
2002 May 16
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Philips Semiconductors
Product specification
600 V driver IC for HF fluorescent lamps
FUNCTIONAL DESCRIPTION Start-up state Initial start-up can be achieved by charging the low voltage supply capacitor C7 (see Fig.8) via an external start-up resistor. Start-up of the circuit is achieved under the condition that both half-bridge transistors TR1 and TR2 are non-conductive. The circuit will be reset in the start-up state. If the low voltage supply (VDD) reaches the value of VDD(H) the circuit will start oscillating. A DC reset circuit is incorporated in the High-Side (HS) driver. Below the lock-out voltage at the FVDD pin the output voltage (VGH - VSH) is zero. The voltages at pins CF and CT are zero during the start-up state. Oscillation The internal oscillator is a Voltage-Controlled Oscillator circuit (VCO) which generates a sawtooth waveform between the CFhigh level and 0 V. The frequency of the sawtooth is determined by capacitor CCF, resistor RIREF, and the voltage at pin CSW. The minimum and maximum switching frequencies are determined by RIREF and CCF; their ratio is internally fixed. The sawtooth frequency is twice the half-bridge frequency. The UBA2014 brings the transistors TR1 and TR2 into conduction alternately with a duty cycle of approximately 50%. An overview of the oscillator signal and driver signals is illustrated in Fig.4. The oscillator starts oscillating at fmax. During the first switching cycle the Low-Side (LS) transistor is switched on. The first conducting time is made extra long to enable the bootstrap capacitor to charge. Adaptive non-overlap The non-overlap time is realized with an adaptive non-overlap circuit (ANT). By using an adaptive non-overlap circuit, the application can determine the duration of the non-overlap time and make it optimum for each frequency (see Fig.4). The non-overlap time is determined by the slope of the half-bridge voltage, and is detected by the signal across resistor R16 which is connected directly to pin ACM. The minimum non-overlap time is internally fixed. The maximum non-overlap time is internally fixed at approximately 25% of the bridge period time. An internal filter of 30 ns is included at the ACM pin to increase the noise immunity. Timing circuit A timing circuit is included to determine the preheat time and the ignition time. The circuit consists of a clock generator and a counter.
UBA2014
The preheat time is defined by CCT and RIREF and consists of 7 pulses at CCT; the maximum ignition time is 1 pulse at CCT. The timing circuit starts operating after the start-up state, as soon as the low supply voltage (VDD) has reached VDD(H) or when a critical value of the lamp voltage (Vlamp(fail)) is exceeded. When the timer is not operating CCT is discharged to 0 V at 1 mA. Preheat state After starting at fmax, the frequency decreases until the momentary value of the voltage across sense resistor R14 reaches the internally fixed preheat voltage level (pin PCS). At crossing the preheat voltage level, the output current of the Preheat Current Sensor circuit (PCS) discharges the capacitor CCSW, thus raising the frequency. The preheat time begins at the moment that the circuit starts oscillating. During the preheat time the Average Current Sensor circuit (ACS) is disabled. An internal filter of 30 ns is included at pin PCS to increase the noise immunity. Ignition state After the preheat time the ignition state is entered and the frequency will sweep down due to charging of the capacitor at pin CSW with an internally fixed current; see Fig.5. During this continuous decrease in frequency, the circuit approaches the resonant frequency of the load. This will cause a high voltage across the load, which normally ignites the lamp. The ignition voltage of a lamp is designed above the Vlamp(fail) level. If the lamp voltage exceeds the Vlamp(fail) level the ignition timer is started. Burn state If the lamp voltage does not exceed the Vlamp(max) level the voltage at pin CSW will continue to increase until the clamp level at pin CSW is reached; see Fig.5. As a consequence the frequency will decrease until the minimum frequency is reached. When the frequency reaches its minimum level it is assumed that the lamp has ignited and the circuit enters the burn state. The Average Current Sensor circuit (ACS) will be enabled. As soon as the averaged voltage across sense resistor R14, measured at pin CS-, reaches the reference level at pin CS+, the average current sensor circuit will take over the control of the lamp current. The average current through R14 is transferred to a voltage at the voltage controlled oscillator and regulates the frequency and, as a result, the lamp current.
2002 May 16
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Philips Semiconductors
Product specification
600 V driver IC for HF fluorescent lamps
Lamp failure mode DURING IGNITION STATE If the lamp does not ignite, the voltage level increases. When the lamp voltage exceeds the Vlamp(max) level, the voltage will be regulated at the Vlamp(max) level; see Fig.6. At crossing the Vlamp(fail) level the ignition timer was already started. If the voltage at pin LVS is above the Vlamp(fail) level at the end of the ignition time the circuit stops oscillating and is forced in a Power-down mode. The circuit will be reset only when the supply voltage is powered-down. DURING BURN STATE If the lamp fails during normal operation, the voltage across the lamp will increase and the lamp voltage will exceed the Vlamp(fail) level; see Fig.7. At that moment the ignition timer is started. If the lamp voltage increases further it will reach the Vlamp(max) level. This forces the circuit to re-enter the ignition state and results in an attempt to re-ignite the lamp. If during restart the lamp still fails, the voltage remains high until the end of the ignition time. At the end of the ignition time the circuit stops oscillating and the circuit will enter in the Power-down mode. Power-down state The Power-down state will be entered if, at the end of the ignition time, the voltage at pin LVS is above Vlamp(fail). In the Power-down mode the oscillator will be stopped and both TR1 and TR2 will be non-conductive. The VDD supply is internally clamped. The circuit is released from the Power-down state by lowering the low voltage supply below VDD(reset). Capacitive mode protection The signal across R16 also gives information about the switching behaviour of the half bridge. If, after the preheat state, the voltage across the ACM resistor (R16) does not exceed the VCMD level during the non-overlap time, the Capacitive Mode Detection circuit (CMD) assumes that the circuit is in the capacitive mode of operation. As a consequence the frequency will directly be increased to fmax. The frequency behaviour is decoupled from the voltage at pin CSW until CCSW has been discharged to zero. Charge coupling
UBA2014
Due to parasitic capacitive coupling to the high voltage circuitry all pins are burdened with a repetitive charge injection. Given the typical application the pins IREF and CF are sensitive to this charge injection. For charge coupling of 8 pC, a safe functional operation of the IC is guaranteed, independent of the current level. Charge coupling at current levels below 50 A will not interfere with the accuracy of the VCS, VPCS and VACM levels. Charge coupling at current levels below 20 A will not interfere with the accuracy of any parameter. Design equations The following design equations are used to calculate the desired preheat time, the maximum ignition time, and the minimum and the maximum switching frequency. tph = 1.7 x 10-4 x CCT x RIREF (s) tign = 3.1 x 10-5 x CCT x RIREF (s) 125 x 10 f min = ------------------------------------- in kHz ( C CF x R IREF ) fmax = 2.5 x fmin (kHz) with CCT in nF, RIREF in k, and CCF in pF. Start of ignition is defined as the moment at which the measured lamp voltage crosses the Vlamp(fail) level; see Section "Lamp failure mode".
3
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Philips Semiconductors
Product specification
600 V driver IC for HF fluorescent lamps
UBA2014
handbook, full pagewidth
MGW582
VCF 0
V(GH-SH) 0
VGL 0
Vhb 0 VACM 0
time
Fig.4 Oscillator and driver signals.
handbook, full pagewidth
Vlamp Vlamp(max) Vlamp(fail)
preheat state
ignition state
burn state
f min detection
Timer on off time
MGW583
Fig.5 Normal ignition behaviour.
2002 May 16
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Philips Semiconductors
Product specification
600 V driver IC for HF fluorescent lamps
UBA2014
handbook, full pagewidth
Vlamp Vlamp(max) Vlamp(fail)
preheat state
ignition state
power-down state
Timer on off time
timer ended
MGW584
Fig.6 Failure mode during ignition.
handbook, full pagewidth
Vlamp Vlamp(max) Vlamp(fail)
burn state
ignition state
power-down state
Timer on off
timer started
timer ended time
MGW585
Fig.7 Failure mode during burn.
2002 May 16
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Philips Semiconductors
Product specification
600 V driver IC for HF fluorescent lamps
UBA2014
LIMITING VALUES In according with the Absolute Maximum Rating System (IEC 60134); voltages with respect to pin GND. SYMBOL VHS VDD(max) VACM(max) VPCS(max) VLVS(max) VCS+(max) VCS-(max) VCSW(max) Tamb Tj Tstg Vesd PARAMETER high side supply voltage maximum voltage at pin VDD maximum voltage at pin ACM maximum voltage at pin PCS maximum voltage at pin LVS maximum voltage at pin CS+ maximum voltage at pin CS- maximum voltage at pin CSW ambient temperature junction temperature storage temperature electrostatic handling voltage pins FVDD, GH, and SH pins CT, CSW, CF, IREF, GL, VDD, PCS, CS-, CS+, Vref, LVS, and ACM Note 1. In accordance with the human body model, i.e. equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) SO16 DIP16 Rth(j-pin) thermal resistance from junction to PCB SO16 DIP16 QUALITY SPECIFICATION In accordance with `SNW-FQ-611-E'. in free air 50 30 K/W K/W PARAMETER thermal resistance from junction to ambient in free air 100 60 K/W K/W CONDITIONS VALUE UNIT note 1 - - 1000 2500 V V CONDITIONS IHS < 30 A; t < 1 s IHS < 30 A MIN. 600 510 - -5 -5 0 0 -0.3 0 -25 -25 -55 - - 14 +5 +5 5 5 +5 5 +80 +150 +150 MAX. V V V V V V V V V C C C UNIT
2002 May 16
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Philips Semiconductors
Product specification
600 V driver IC for HF fluorescent lamps
UBA2014
CHARACTERISTICS All voltages referenced to GND; VDD = 13 V; VFVDD - VSH = 13 V; Tamb = 25 C; unless otherwise specified; see Chapter "Application information". SYMBOL High-voltage supply Ileak Start-up state VDD VDD(start) VDD(low) VDD(hys) IDD(start) VDD(clamp) Ipd VDD(reset) IDD supply voltage for defined driver output oscillator start voltage oscillator stop voltage start-stop hysteresis start-up current clamp voltage power-down current reset voltage operating supply current VDD < VDD(start) Power-down mode VDD = 9 V TR1 = off; TR2 = off fbridge = 40 kHz without gate drive IL = 10 A TR1 = off; TR2 = off - 12.4 8.6 3.5 - 10 - 4.5 - - 13.0 9.1 3.9 170 11 170 5.5 1.5 6 13.6 9.6 4.4 200 12 200 7.0 2.2 V V V V A V A V mA leakage current on high-voltage pins voltage at pins FVDD, GH and SH = 600 V - - 30 A PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Reference voltage VVref Isource(Vref) Isink(Vref) ZVref VVref/T reference voltage source current capability sink current capability output impedance temperature coefficient IL = 1 mA source IL = 10 A; Tamb = 25 to 150 C 2.86 1 1 - - 2.95 - - 3.0 -0.64 3.04 - - - - V mA mA %/K
Current supply VIREF IIREF VCSW Vclamp ICF(start) tstart ICF(min) ICF(max) fmax fmin fstab VCF(high) tnc(min) voltage at pin IREF reference current range - 65 2.5 - 3.0 3.1 4.5 50 21 54 100 40.5 1.3 2.5 0.90 1.00 - 95 V A V V A s A A kHz kHz % V s s
Voltage controlled oscillator control voltage clamp voltage output oscillator start current first output oscillator stroke time minimum output oscillator current maximum output oscillator current maximum bridge frequency minimum bridge frequency frequency stability high level output oscillator voltage minimum non-overlap time Tamb = -20 to +80 C f = fmin GH to GL GL to GH 2002 May 16 11 VCF = 1.5 V VCF = 1.5 V burn state VCF = 1.5 V 2.7 2.8 3.8 - - - 90 38.9 - - 0.68 0.75 3.3 3.4 5.2 - - - 110 42.1 - - 1.13 1.25
Philips Semiconductors
Product specification
600 V driver IC for HF fluorescent lamps
UBA2014
SYMBOL tno(max) Io(source)(GH) Io(sink)(GH) Io(source)(GL) Io(sink)(GL) VOH(GH)(h) VOL(GH)(h) VOH(GL)(l) VOL(GL)(l) RHS(on) RHS(off) RLS(on) RLS(off) Vboot VFVDD IFVDD
PARAMETER maximum non-overlap time
CONDITIONS fbridge = 40 kHz; note 1 VGH - VSH = 0 VGH - VSH = 13 V VGL = 0 VGL = 13 V Io = 10 mA Io = 10 mA Io = 10 mA Io = 10 mA Io = 10 mA Io = 10 mA Io = 10 mA I = 5 mA -
MIN.
TYP. 7.5
MAX. - 235 415 235 415 - 0.5 - 0.5 45 26 45 26 2.1 4.2 -
UNIT s mA mA mA mA V V V V V V A
Output drivers high side output source current high side output sink current low side output source current low side output sink current LOW-level high side output voltage HIGH-level low side output voltage LOW-level low side output voltage high side on resistance high side off resistance low side on resistance low side off resistance bootstrap diode forward drop voltage lockout voltage floating well supply current DC level at VGH - VSH = 13 V VPCS = 0.6 V VCSW = 2.0 V VCSW = 2.0 V VACM = 0.6 V 135 265 135 265 12.5 - 12.5 - 32 16 32 16 1.3 2.8 - 180 330 200 330 - - - - 39 21 39 21 1.7 3.5 35
HIGH-level high side output voltage Io = 10 mA
Preheat current sensor Ii(PCS) Vph Io(source)(CSW) Io(sink)(CSW) Ii(ACM) VCMD+ VCMD- input current preheat voltage level at pin PCS output source current effective output sink current - 0.57 9.0 - - 80 -68 - 0.60 10 10 - 100 -85 1 0.63 11 - 1 120 -102 A V A A A mV mV
Adaptive non-overlap and capacitive mode detection input current positive capacitive mode detection voltage negative capacitive mode detection voltage
Lamp voltage sensor Ii(LVS) Vlamp(fail) Vlamp(fail)(hys) Vlamp(max) Io(sink)(CSW) Io(source)(ign) input current lamp fail voltage level at pin LVS hysteresis lamp fail voltage level at pin LVS maximum lamp voltage level at pin LVS output sink current ignition output source current VCSW = 2.0 V VCSW = 2.0 V VLVS = 0.81 V - 0.77 119 1.44 27 9.0 - 0.81 144 1.49 30 10 1 0.85 169 1.54 33 11 A V mV V A A
2002 May 16
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Philips Semiconductors
Product specification
600 V driver IC for HF fluorescent lamps
UBA2014
SYMBOL Average current sensor Ii(CS) Voffset gm Io(CSW) Timer Io(CT) VOL(CT) VOH(CT) Vhys(CT) tph tign Note
PARAMETER
CONDITIONS -
MIN. - 0
TYP.
MAX.
UNIT A mV A/mV A A V V V s s
input current offset voltage transconductance output current
VCS = 0 V VCS+ = VCS- = 0 to 2.5 V f = 1 kHz
1 +2 5700 105
-2 1900
3800 95
source and sink; VCSW = 2 V 85 VCT = 2.5 V 5.5 - - 2.05 CCT = 330 nF and RIREF = 33 k CCT = 330 nF and RIREF = 33 k 1.6 -
preheat timer output current LOW-level preheat timer output voltage HIGH-level preheat timer output voltage preheat timer output hysteresis preheat time ignition time
5.9 1.4 3.6 2.20 1.8 0.26
6.3 - - 2.35 2.0 -
1. The maximum non-overlap is determined by the level of the CF signal. If this signal exceeds a level of 1.25 V the non-overlap will end, resulting in a maximum non-overlap time of 7.5 s at a bridge frequency of 40 kHz.
2002 May 16
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REFERENCE CURRENT
VOLTAGE CONTROLLED OSCILLATOR 5 GND 3 CF 2
AVERAGE CURRENT SENSOR 14 Vref
- +
16 CS - 15 CS +
R8 8.2 k
C19 56 nF
R5 10 k
D4 BYD77D
C17 6.8 nF
C22 8.2 nF
Lamp
2002 May 16
+
APPLICATION INFORMATION
Philips Semiconductors
600 V driver IC for HF fluorescent lamps
F1 1A
9 FVDD 10 GH BOOTSTRAP VDD 7 HIGH SIDE DRIVER 11 SH C6 1.2 nF SUPPLY DRIVER CONTROL LOW SIDE DRIVER 6 GL TR2 IRF820 C10 5.6 nF C5 100 nF TR1 IRF820
D1 BYD77D L1 1.9 mH
R10 1 M
R1 1 M
UBA2014
VDC 400 V
ADAPTIVE NON-OVERLAP TIMING AND CAPACITIVE MODE DETECTOR
Z1 12 V
12 ACM
R16 1.5 CT 1 PREHEAT TIMER PREHEAT CURRENT SENSOR 8 PCS R13 150 13 LVS R9 47 R20 220 k C8 330 pF
C24 100 nF
14
C7 330 nF C15 330 nF
DIVIDER
LAMP VOLTAGE SENSOR
TLD36W
4 IREF
C23 100 nF R4 1 M C2 12 nF R3 220 k C3 1 nF R2 8.2 k R18 180 k
MGW586
CSW
R14 1
R12 33 k
C14 100 pF
C13 220 nF
C20 68 nF
Product specification
UBA2014
Fig.8 Test and application circuit.
Philips Semiconductors
Product specification
600 V driver IC for HF fluorescent lamps
PACKAGE OUTLINES SO16: plastic small outline package; 16 leads; body width 3.9 mm
UBA2014
SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp 1 e bp 8 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07 JEDEC MS-012 EIAJ EUROPEAN PROJECTION
ISSUE DATE 97-05-22 99-12-27
2002 May 16
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Philips Semiconductors
Product specification
600 V driver IC for HF fluorescent lamps
UBA2014
DIP16: plastic dual in-line package; 16 leads (300 mil); long body
SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH wM (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001 EIAJ SC-503-16 EUROPEAN PROJECTION
ISSUE DATE 95-01-19 99-12-27
2002 May 16
16
Philips Semiconductors
Product specification
600 V driver IC for HF fluorescent lamps
SOLDERING Introduction This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mount components are mixed on one printed-circuit board. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Through-hole mount packages SOLDERING BY DIPPING OR BY SOLDER WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joints for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. MANUAL SOLDERING Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. Surface mount packages REFLOW SOLDERING Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (pre-heating, soldering and cooling) vary between 100 and 200 seconds depending on heating method.
UBA2014
Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. WAVE SOLDERING Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. MANUAL SOLDERING Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 17
2002 May 16
Philips Semiconductors
Product specification
600 V driver IC for HF fluorescent lamps
Suitability of IC packages for wave, reflow and dipping soldering methods
UBA2014
SOLDERING METHOD MOUNTING PACKAGE WAVE Through-hole mount DBS, DIP, HDIP, SDIP, SIL Surface mount BGA, HBGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS PLCC(4), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. 4. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 5. Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 6. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. suitable(2) not suitable not suitable(3) suitable not recommended(4)(5) not recommended(6) REFLOW(1) DIPPING - suitable suitable suitable suitable suitable suitable - - - - -
2002 May 16
18
Philips Semiconductors
Product specification
600 V driver IC for HF fluorescent lamps
DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS
UBA2014
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
Preliminary data
Qualification
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
2002 May 16
19
Philips Semiconductors - a worldwide company
Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
(c) Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613502/01/pp20
Date of release: 2002
May 16
Document order number:
9397 750 09094

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